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A New Generation of Laser Direct Imaging

Aiscent Technologies Inc Announced the Availability of the First Two-Sided LDI System at CPCA 2012

Aiscent Technologies Inc announced the availability of the first two-sided LDI System in the PCB and IC substrate industry at CPCA SHOWS 2012, Shanghai 

March 15, 2012

Aiscent Technologies Inc unveiled the first two-sided laser direct imaging system in the PCB industry at CPCA SHOWS, Shanghai. This is yet another breakthrough from the traditional LDI single-sided imaging mechanism, the two-sided system will not only increase the throughput, but one for all solved the top and bottom registration problem. The two-sided ALDI-PB laser direct imaging system will be available for installation by June, 2012.

Dr Du, CEO of Aiscent Technologies Inc, also gave a talk at the CPCA SHOWS about the "Applications of two-sided ALDI High Density Packaging LDI system in HDI and IC Substrates", he also discussed and gave his point of view about the potential of this technology in helping to simplify the process in meeting the high density packaging requirements.

Laser direct imaging has known to be the better and more reliable solution for the production of high quality fine resolution PCB in the future, the two-sided LDI system is the breakthrough of this technology, eliminates the problem of single-sided LDI system in achieving better top and bottom registration, especially for fine resolution and high throughput requirement.

The Secretary General of CPCA visited Aiscent Technologies, Inc's booth at CPCA and was impressed about the development of Aiscent's LDI system. (Picture above from the left: Dr. Du (CEO of Aiscent Technologies, Inc), Dr. Nakahara (Consultant of IPC) and Mr Wang (Secretary General of CPCA)).